Hokuyo – DMJ-HB1 / DMJ-HB1-Z01 / DMJ-HB1-Z50

Optical Parallel Data Transmission for Modular Industrial Communication

Brand : Hokuyo

The Hokuyo DMJ-HB1 series is a family of modular optical data transmission devices designed for robust parallel I/O communication in automated material handling and semiconductor automation systems. These devices use pulse-modulated infrared optical signals to transmit and receive 8-bit parallel data in a half-duplex two-way transmission system, allowing reliable optical communication between aligned units without physical cabling. The basic DMJ-HB1 provides a typical transmission distance of about 1 m with a ~30° directional angle, while the DMJ-HB1-Z01 and DMJ-HB1-Z50 variants add adjustability and optimized transmission characteristics for installation convenience and environmental resistance. Each model supports standard industrial inputs and NPN open-collector outputs with robust protection against vibration, impact, and ambient light, making them suitable for AGV docking, conveyor communication, and SEMI E84 automation interfaces.

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Specifications

Specification DMJ-HB1 DMJ-HB1-Z01 DMJ-HB1-Z50
Product Type Modular optical data transmission device (parallel I/O, semiconductor automation version) :contentReference
Transmission System Half-duplex two-way transmission system
Transmission Capacity (Input/Output) 8-bit / 8-bit
Transmission Distance ~1 m typical ~0.6 m (adjustable) ~1 m (adjustable)
Directional Angle (Full Angle) ~30° ~30° ~30°
Transmission Time 40 ms (DMJ-HB1 / Z01) / 45 ms (Z50)
Modulation Method Pulse modulation
Detection Method Parity check (continuous error logic)
Power Source 24 VDC
Current Consumption ≤100 mA
Input IN1–IN8, SELECT, MODE, threshold ON ≥2.5 mA, OFF ≤1 mA
Output OUT1–OUT8, NPN open-collector (≤30 V, ≤50 mA, residual voltage ≤1.8 V)
Ambient Illuminance ≤4,000 lux (incandescent lamp)
Ambient Temp / Humidity -10 to +50 °C, ≤85 %RH
Vibration Resistance 10–55 Hz, double amplitude 1.5 mm, 2 h each X/Y/Z
Impact Resistance 500 m/s², 10 times per axis
Connection Modular RJ-11 to DB25 or direct socket depending on configuration
Protective Structure IP40 (IEC standard)
Case Material Polycarbonate
Weight Head approx. 50 g, connector approx. 70 g

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